Investigation of the coefficient of thermal expansion in nanocrystalline diamond films

Diamond and Related Materials

Volumn 18, Issue 2-3, 2009, Pages 224-228

  Woehrl, N ^a   Hirte, T ^a   Posth, O ^a   Buck, V ^a  

^a UNIVERSITY OF DUISBURG ESSEN   (Germany)

Author keywords

Coefficient of thermal expansion; Diamond; Nanocrystalline; Residual stress

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CONDUCTIVE FILMS; DIAMOND CUTTING TOOLS; DIAMOND FILMS; DIAMONDS; ELECTRODEPOSITION; EXPANSION; HYDROGEN; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE MATERIALS; NANOSTRUCTURED MATERIALS; NITROGEN; NONMETALS; OPTICAL INSTRUMENTS; ORGANIC POLYMERS; PLASMAS; RESIDUAL STRESSES; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON COMPOUNDS; STRENGTH OF MATERIALS; SUBSTRATES; THERMAL SPRAYING; THERMAL STRESS;

A THERMALS; COEFFICIENT OF THERMAL EXPANSION; COEFFICIENTS OF THERMAL EXPANSIONS; DIAMOND; EX-SITU; FILM PERFORMANCE; FILM PROPERTIES; HIGH TEMPERATURES; MICROWAVE PLASMAS; NANO-MATERIALS; NANOCRYSTALLINE; NANOCRYSTALLINE DIAMOND FILMS; NCD FILMS; NITROGEN-DOPED; PROCESS GAS; PROCESS PARAMETERS; RESIDUAL STRESS; SILICON SUBSTRATES; STRESS COMPONENTS; SUBSTRATE TEMPERATURES; THERMAL EXPANSION CO-EFFICIENT; TUNABLE PROPERTIES; TWO COMPONENTS;

THERMAL EXPANSION;

EID: 59649086103     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2008.10.016     Document Type: Article

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