Cost-effective form factor reduction

Printed Circuit Fabrication

Volumn 19, Issue 10, 1996, Pages 36-39

  Winkel, Heinz ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5944238796     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. BPA (Technology & Management Ltd.), "Multichip Modules: A World Analysis 1988-1997", Report #289, 1988.
2. TechSearch Intl. Inc., "Low Cost Substrates for Higher Density Packaging", January 1995.
3. Walter Schmidt et al, "A Revolutionary Answer to Today's and Future Interconnect Challenges," IPC World Conference VI, May 1993.
4. D.P. Seraphim, R.C. Lasky, and C.Y. Li, "Principles of Electronic Packaging," McGraw-Hill Book Co., 1989, pp. 39-52.
5. Manfred Buchwald, Peter Stimpfig, "Dycostrate," newsletter for ZukenRedac customers, Winter 1994-1995, pp. 9-10.
6. Happy T. Holden, "Using Conventional PCB Build-Up Technology to Reduce the Cost and Design Complexity for MCMLs," ISHM Advanced Microelectronics, April 1995.