Does Adhesive Thickness Affect Resin-dentin Bond Strength after Thermal/Load Cycling?

Operative Dentistry

Volumn 34, Issue 1, 2009, Pages 58-64

  Lodovici, E ^a   Reis, A ^b,e   Geraldeli, S ^c   Ferracane, J L ^d   Ballester, R Y ^a   Filho, L E R ^a  

^a UNIVERSITY OF SÃO PAULO   (Brazil)

^b STATE UNIVERSITY OF PONTA GROSSA   (Brazil)

^c UNIVERSITY OF IOWA   (United States)

^d OREGON HEALTH AND SCIENCE UNIVERSITY   (United States)

^e Rua Carlos Cavalcanti 4748 Bloco M Sala 64 A Uvaranas   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMEDICAL AND DENTAL MATERIALS; CLEARFIL SE BOND; DENTIN BONDING AGENT; FILTEK Z250; INORGANIC COMPOUND; RESIN; RESIN CEMENT; SCOTCHBOND MULTI PURPOSE; SCOTCHBOND MULTI-PURPOSE; SILICON CARBIDE; SILICON DERIVATIVE; WATER;

ARTICLE; CHEMISTRY; COMPARATIVE STUDY; DENTAL ACID ETCHING; DENTAL BONDING; DENTAL SURGERY; DENTIN; HUMAN; MATERIALS TESTING; MECHANICAL STRESS; METHODOLOGY; PLIABILITY; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY; TEMPERATURE; TENSILE STRENGTH; ULTRASTRUCTURE;

ACID ETCHING, DENTAL; CARBON COMPOUNDS, INORGANIC; COMPOSITE RESINS; DENTAL BONDING; DENTAL MATERIALS; DENTIN; DENTIN-BONDING AGENTS; HUMANS; MATERIALS TESTING; MICROSCOPY, ELECTRON, SCANNING; PLIABILITY; RESIN CEMENTS; SILICON COMPOUNDS; SMEAR LAYER; STRESS, MECHANICAL; SURFACE PROPERTIES; TEMPERATURE; TENSILE STRENGTH; WATER;

EID: 58649109976     PISSN: 03617734     EISSN: None     Source Type: Journal    
DOI: 10.2341/08-37     Document Type: Article

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