Electroless copper plating on acrylonitrile butadiene styrene material surfaces without chromic acid etching and a palladium catalyst

Journal of Applied Polymer Science

Volumn 111, Issue 2, 2009, Pages 1034-1044

  Inagaki, Norihiro ^a   Kimura, Hajime ^a  

^a SHIZUOKA UNIVERSITY   (Japan)

Author keywords

Adhesion; ESCA XPS; FT IR; Metal polymer complexes; Surfaces

Indexed keywords

ACIDS; ADHESION; BUTADIENE; CARBOXYLIC ACIDS; CATALYSIS; CATALYSTS; COPPER; COPPER PLATING; CYANIDES; ELECTROPLATING; ETCHING; ETHERS; HYDROLYSIS; LEAD ACID BATTERIES; ORGANIC ACIDS; PALLADIUM; PLATE METAL; PLATING; SILVER; SODIUM; STYRENE; SURFACES;

ACID ETCHING; ACID GROUPS; ACRYLONITRILE BUTADIENE STYRENE (ABS); COPPER METAL; ELECTROLESS; ELECTROLESS COPPER PLATING; ELECTROLESS COPPERING; ESCA/XPS; ETCHING PROCESSES; ETCHING REACTIONS; FT-IR; MATERIAL SURFACES; METAL-POLYMER COMPLEXES; MIXTURE SOLUTION; NAOH SOLUTIONS; NITRILE GROUPS; PALLADIUM CATALYSTS; PLATE SURFACES; PLATING PROCESSES; SCOTCH TAPE TESTS; SILVER CATALYSTS; SODIUM HYDROXIDE (NAOH);

SURFACE REACTIONS;

CATALYST; CHEMICAL ETCHING; COPPER; ELECTROLESS PLATING; HYDROLYSIS;

EID: 58449099366     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.29144     Document Type: Article

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