Fatigue behavior of ultrafine-grain copper in very high cycle fatigue regime

VHCF-4 - 4th International Conference on Very High Cycle Fatigue

Volumn , Issue , 2007, Pages 265-270

  Lukáš, Petr ^a   Kunz, Ludvík ^a   Svoboda, Milan ^a   Bokůvka, Otakar ^b  

^a INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

^b UNIVERSITY OF ILINA   (Slovakia)

Author keywords

Fatigue strength; Ultrafine grain copper; Ultrasonic frequency

Indexed keywords

COPPER; CRACKS; EQUAL CHANNEL ANGULAR PRESSING; FATIGUE CRACK PROPAGATION; METAL PRESSING; PRESSING (FORMING); ULTRASONIC WAVES; ULTRASONICS;

ELECTRON BACK SCATTERING DIFFRACTIONS; EQUAL-CHANNEL ANGULAR PRESSINGS; FATIGUE BEHAVIORS; FATIGUE LOADINGS; FATIGUE STRENGTH; FREQUENCY RANGES; GRAIN MORPHOLOGIES; SHEAR PLANES; SURFACE FATIGUES; UFG COPPERS; ULTRAFINE; ULTRAFINE-GRAIN COPPER; ULTRASONIC FREQUENCY; VERY HIGH CYCLE FATIGUES;

FATIGUE OF MATERIALS;

EID: 58349086748     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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