Development of microfluidic devices using LTCC substrates

Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Volumn , Issue , 2005, Pages 337-342

  Leminski, Roberto Eduardo Bmzetti ^a   Simões, Eliphas Wagner ^a,b   Furlan, Rogerio ^a,c   Gongora Rubio, Mário Ricardo ^a,b   Da Rocha, Zaira Mendes ^a   Da Cunha, Márcio Rodrigues ^a,b   Ramos, Idalia ^c   Morimoto, Nilton Itiro ^a   Santiago Aviles, J J ^d  

^a UNIVERSITY OF SÃO PAULO   (Brazil)

^b Instituto de Pesquisas Tecnologicas   (Brazil)

^c UNIVERSITY OF PUERTO RICO   (Puerto Rico)

^d UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

CNC milling; Jet vapor etch; LTCC machining; Mold replication

Indexed keywords

CNC MILLING; COMPUTER NUMERICAL CONTROLLED; GLASS CERAMIC COMPOSITES; LOW-TEMPERATURE CO-FIRED CERAMICS; MICRO-FLUIDIC DEVICES; MICROELECTRONICS PROCESS; MICROMACHINING PROCESS; THREE-DIMENSIONAL STRUCTURE;

ACETONE; ASPECT RATIO; CERAMIC MATERIALS; CHEMICAL REACTORS; COMPUTER APPLICATIONS; EXHIBITIONS; FABRICATION; HYBRID MATERIALS; MECHANICAL PROPERTIES; MICROELECTRONICS; MICROFLUIDICS; MICROSYSTEMS; MILLING (MACHINING); MOLDS; VAPORS;

FLUIDIC DEVICES;

EID: 58149361745     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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