An alternative method for the cooling of power microelectronics using classical

Journal of Electronic Packaging

Volumn 130, Issue 4, 2008, Pages 0411031-0411035

  Chiriac, Victor ^a   Chiriac, Florea ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b TECHNICAL UNIVERSITY OF CIVIL ENGINEERING   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

AIR CONDITIONING; ELECTRONIC COOLING; EVAPORATORS; MICROELECTRONICS; POLYCHLORINATED BIPHENYLS; POLYOLS; PRINTED CIRCUIT BOARDS; REFRIGERATION; REFRIGERATORS;

COEFFICIENT OF PERFORMANCE; COOLING FIELDS; HIGH POWER; INDUSTRIAL SYSTEMS; LARGE-SCALES; MICRO ELECTRONICS COOLING; POWER MICROELECTRONICS; REFRIGERATION SYSTEM; SMALL SCALE; VAPOUR COMPRESSIONS;

REFRIGERANTS;

EID: 58149269241     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2993148     Document Type: Conference Paper

References (14)

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