Designing a mesoscale vapor-compression refrigerator for cooling high-power microelectronics

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 218-223

  Phelan, Patrick E ^a   Swanson, Jason ^a   Chiriac, Florea ^b   Chiriac, Victor ^c  

^a Arizona State University   (United States)

^b TECHNICAL UNIVERSITY OF CIVIL ENGINEERING   (Romania)

^c MOTOROLA INC   (United States)

Author keywords

Compressor; Cooling; Electronics; Miniature; Refrigeration

Indexed keywords

COEFFICIENT OF PERFORMANCE (COP); MINIATURE; SCROLL COMPRESSORS;

AMMONIA; CAPILLARY TUBES; COMPRESSORS; COOLING; ENTHALPY; EVAPORATORS; HEAT EXCHANGERS; INTEGRATED CIRCUITS; MICROELECTRONICS; REFRIGERATION;

REFRIGERATORS;

EID: 4444284919     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Phelan, P.E., Chiriac, V., & Lee, T.-Y., 2003, "Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging," Paper No. InterPack2003-35140, Proceedings of IPACK03, International Electronic Packaging Technical Conference and Exhibition, July 6-11, Maui, Hawaii, USA; submitted to the ASME Journal of Electronic Packaging.
2. Heydari, A., 2002, "Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers," Proceedings of ITHERM 2002, Inter Society Conference on Thermal Phenomena, pp. 371-378.
3. Phelan, P.E., Chiriac, V., & Lee, T., 2002, "Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics," IEEE Transactions on Components and Packaging Technologies, Vol. 25, pp. 356-365.
4. nd Ed., McGraw Hill Inc., New York, pp. 11.1-11.57.