Measurement of coefficient of thermal expansion of films using digital image correlation method

Polymer Testing

Volumn 28, Issue 1, 2009, Pages 75-83

  Bing, Pan ^a   Hui min, Xie ^a   Tao, Hua ^a   Asundi, Anand ^b  

^a TSINGHUA UNIVERSITY   (China)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Coefficient of thermal expansion; Digital image correlation; Film; Thermal deformation

Indexed keywords

COMPOSITE FILMS; COPPER; CORRELATION METHODS; DEFORMATION; DIGITAL IMAGE STORAGE; ORGANIC POLYMERS; POLYIMIDES; POLYMERS; STRAIN MEASUREMENT; THERMAL SPRAYING; THERMAL STRESS; THERMOANALYSIS;

COEFFICIENT OF THERMAL EXPANSION; DEFORMATION FIELDS; DIGITAL IMAGE CORRELATION; DIGITAL IMAGE CORRELATION METHODS; EFFECTIVE TOOLS; HEATING CHAMBERS; NORMAL STRAINS; PURE COPPERS; REGION OF INTERESTS; RIGID BODIES; TEMPERATURE CHANGES; TEMPERATURE RANGES; THERMAL DEFORMATION;

THERMAL EXPANSION;

EID: 58149250202     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2008.11.004     Document Type: Article

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