Effects of a Cu-contained compound on the microstructures and thermoelectric properties of Zn-Sb based alloys

Current Applied Physics

Volumn 9, Issue 3, 2009, Pages 713-716

  Cui, J L ^a   Mao, L D ^b   Chen, D Y ^c   Qian, X ^b   Liu, X L ^a   Yang, W ^a  

^a NINGBO UNIVERSITY OF TECHNOLOGY   (China)

^b ZHEJIANG UNIVERSITY OF TECHNOLOGY   (China)

^c CHINA UNIVERSITY OF MINING AND TECHNOLOGY   (China)

Author keywords

Intermetallic compounds; Sintering; Thermoelectric properties

Indexed keywords

ALLOYS; ANTIMONY COMPOUNDS; CERIUM ALLOYS; COPPER; INTERMETALLICS; METALLIC COMPOUNDS; MICROSTRUCTURE; RIETVELD METHOD; RIETVELD REFINEMENT; SEMICONDUCTING INTERMETALLICS; SINTERING; SOLDERING ALLOYS; SPARK PLASMA SINTERING; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC POWER; TRANSPORT PROPERTIES; ZINC;

FIGURE OF MERITS; IMPURITY PHASES; INTERMETALLIC COMPOUNDS; INTERMETALLIC PHASE; SPARK PLASMAS; THERMOELECTRIC PROPERTIES;

COPPER ALLOYS;

EID: 58149214007     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2008.06.012     Document Type: Article

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