Sensitivity of the macroscopic thermal conductivity tensor to topological microstructural changes

Computer Methods in Applied Mechanics and Engineering

Volumn 198, Issue 5-8, 2009, Pages 727-739

  Giusti, S M ^a   Novotny, A A ^a   de Souza Neto, E A ^b   Feijoo R A ^a  

^a LABORATÓRIO NACIONAL DE COMPUTAÇÃO CIENTÍFICA   (Brazil)

^b SWANSEA UNIVERSITY   (United Kingdom)

Author keywords

Heat conductivity tensor; Multi scale modelling; Sensitivity analysis; Topological derivative

Indexed keywords

HEAT CONDUCTION; REAL TIME SYSTEMS; SEISMIC DESIGN; TENSORS; THERMAL CONDUCTIVITY; TOPOLOGY; VOLUME MEASUREMENT;

CIRCULAR INCLUSIONS; CLOSED FORMS; CONDUCTING MATERIALS; DO-MAINS; FOURIER LAWS; MACROSCOPIC CONDUCTIVITIES; MACROSCOPIC TEMPERATURES; MICROSTRUCTURAL CHANGES; MULTI-SCALE MODELLING; OPTIMISATION; POTENTIAL APPLICATIONS; REPRESENTATIVE VOLUME ELEMENTS; SECOND ORDERS; TENSOR FIELDS; TOPOLOGICAL DERIVATIVE; TWO-DIMENSIONAL PROBLEMS; VOLUME AVERAGES;

SENSITIVITY ANALYSIS;

EID: 58149151207     PISSN: 00457825     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cma.2008.10.005     Document Type: Article

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