Multi-layer fringe-field augmentations for the efficient modeling of package power planes

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 331-334

  Bharath, Krishna ^a   Sankaran, Nithya ^a   Engin, A Ege ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROSTATIC SOLVERS; FINITE DIFFERENCES; FREQUENCY DOMAINS; FRINGE FIELDS; IRREGULAR GEOMETRIES; MODELING METHODS; PACKAGE INTEGRATIONS; POWER DISTRIBUTION NETWORKS; POWER PLANES; SOLUTION TECHNIQUES; WAVE SIMULATIONS;

DISTRIBUTED PARAMETER NETWORKS; DISTRIBUTION OF GOODS; ELECTRIC POWER DISTRIBUTION; ELECTRIC SIGNAL SYSTEMS; SIGNAL SYSTEMS;

ELECTRONICS PACKAGING;

EID: 58049117819     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2008.4675948     Document Type: Conference Paper

References (8)

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