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Volumn 209, Issue 3, 2009, Pages 1471-1476

Effect of thermal cycling on the expansion behavior of Al/SiCp composite

Author keywords

Al SiCp composite; Coefficient of thermal expansion; Plastic strain; Residual stress

Indexed keywords

ALUMINA; CARBON FIBER REINFORCED PLASTICS; LIQUID METALS; METALLIC MATRIX COMPOSITES; PLASTIC DEFORMATION; POLYMER MATRIX COMPOSITES; RESIDUAL STRESSES; SILICON CARBIDE; STRENGTH OF MATERIALS; THERMAL CYCLING; THERMAL SPRAYING; THERMAL STRESS;

EID: 57949084869     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.03.054     Document Type: Article
Times cited : (48)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.