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Volumn 209, Issue 3, 2009, Pages 1143-1150

Temperature and stress distribution in ultrasonic metal welding-An FEA-based study

Author keywords

Anvil; Sonotrode; Ultrasonic metal welding; Weld interface

Indexed keywords

FINITE ELEMENT METHOD; METALS; PRESSURE WELDING; SHEET METAL; STRESS CONCENTRATION; STRESSES; TOOLS; ULTRASONIC WELDING; ULTRASONICS; WELDED STEEL STRUCTURES; WELDS;

EID: 57949083418     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.03.032     Document Type: Article
Times cited : (188)

References (11)
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    • Daniels, H.P.C.1
  • 4
    • 57949110916 scopus 로고    scopus 로고
    • De Vries, E., 2004. Mechanics and Mechanism of Ultrasonic Metal Welding, Dissertation, The Ohio State University.
    • De Vries, E., 2004. Mechanics and Mechanism of Ultrasonic Metal Welding, Dissertation, The Ohio State University.
  • 5
    • 27744498826 scopus 로고    scopus 로고
    • Numerical analysis of ultrasonic wire bonding: effects of bonding parameters on contact pressure and frictional energy
    • Ding Y., Kim J., and Tong P. Numerical analysis of ultrasonic wire bonding: effects of bonding parameters on contact pressure and frictional energy. Mech. Mater. 38 (2001) 11-24
    • (2001) Mech. Mater. , vol.38 , pp. 11-24
    • Ding, Y.1    Kim, J.2    Tong, P.3
  • 6
    • 0014780963 scopus 로고
    • Additional studies on interface temperatures and bonding mechanisms of ultrasonic welds
    • Hazlett T.H., and Ambekar S.M. Additional studies on interface temperatures and bonding mechanisms of ultrasonic welds. Weld. Res. Suppl. 49 (1970) 196-200
    • (1970) Weld. Res. Suppl. , vol.49 , pp. 196-200
    • Hazlett, T.H.1    Ambekar, S.M.2
  • 7
    • 0035472668 scopus 로고    scopus 로고
    • A micro contact approach for ultrasonic wire bonding in microelectronics
    • Jeng Y.R., and Horng J.H. A micro contact approach for ultrasonic wire bonding in microelectronics. J. Tribol. 123 (2001) 725-731
    • (2001) J. Tribol. , vol.123 , pp. 725-731
    • Jeng, Y.R.1    Horng, J.H.2
  • 8
    • 0015200210 scopus 로고
    • The formation of ultrasonic bond between metals
    • Joshi K.C. The formation of ultrasonic bond between metals. Weld. J. 50 (1971) 840-848
    • (1971) Weld. J. , vol.50 , pp. 840-848
    • Joshi, K.C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.