Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

Mechanics of Materials

Volumn 38, Issue 1-2, 2006, Pages 11-24

  Ding, Yong ^a   Kim, Jang Kyo ^a   Tong, Pin ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Contact pressure; Finite element method; Frictional energy intensity; Ultrasonic wire bonding; Wire bondability

Indexed keywords

FINITE ELEMENT METHOD; FRICTION; NUMERICAL ANALYSIS; ULTRASONICS;

CONTACT PRESSURE; FRICTIONAL ENERGY INTENSITY; ULTRASONIC WIRE BONDING; WIRE BONDABILITY;

WIRE;

EID: 27744498826     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechmat.2005.05.007     Document Type: Conference Paper

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