Growth behavior of electroless Ni-Co-P deposits on Fe

Applied Surface Science

Volumn 255, Issue 6, 2009, Pages 3880-3883

  Liu, W L ^a   Hsieh, S H ^a   Chen, W J ^b   Hsu, Y C ^c  

^a NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^b NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Activation energy; Electroless deposition; Growth behavior; Ni Co P alloy; Plating rate

Indexed keywords

ACTIVATION ENERGY; COBALT ALLOYS; COBALT COMPOUNDS; ELECTROLESS PLATING; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INDIUM PLATING; ION SOURCES; IRON; METALLIC FILMS; NICKEL ALLOYS; NICKEL SULFATES; SPECTROMETERS; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROLESS NI; ENERGY DISPERSIVE SPECTROMETERS; GROWTH BEHAVIOR; NI-CO-P ALLOYS; NICKEL AND COBALTS; PLATING BATH; PLATING RATES; SODIUM HYPOPHOSPHITE;

SULFUR COMPOUNDS;

EID: 57849096673     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.10.073     Document Type: Article

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