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Volumn 33, Issue 1, 2009, Pages 55-61

Determination of the friction coefficient during glass polishing

Author keywords

Finishing; Friction mechanisms; Friction test methods; Glass; Polishing

Indexed keywords

ELECTRICAL SYSTEMS; FRICTION BEHAVIORS; FRICTION COEFFICIENTS; FRICTION MECHANISMS; FRICTION TEST METHODS; GLASS POLISHING; POLISHING PADS; POLISHING PARAMETERS; POLISHING PROCESSES;

EID: 57749203808     PISSN: 10238883     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11249-008-9391-5     Document Type: Article
Times cited : (29)

References (28)
  • 1
    • 57749169366 scopus 로고
    • Chemical and physico-chemical reactions in the grinding and polishing of glass
    • FW Preston 1923 Chemical and physico-chemical reactions in the grinding and polishing of glass J. Soc. Glass Technol. 14 127
    • (1923) J. Soc. Glass Technol. , vol.14 , pp. 127
    • Preston, F.W.1
  • 2
    • 57749190886 scopus 로고
    • The nature of the polishing operation
    • FW Preston 1925 The nature of the polishing operation Trans. Opt. Soc. 3 26
    • (1925) Trans. Opt. Soc. , vol.3 , pp. 26
    • Preston, F.W.1
  • 3
    • 0001611894 scopus 로고
    • The theory and design of plate glass polishing
    • FW Preston 1927 The theory and design of plate glass polishing J. Soc. Glass Technol. 11 214 256
    • (1927) J. Soc. Glass Technol. , vol.11 , pp. 214-256
    • Preston, F.W.1
  • 4
    • 0002227337 scopus 로고
    • Planarizing interlevel dielectrics by chemical-mechanical polishing
    • 5
    • S Sivaram 1992 Planarizing interlevel dielectrics by chemical-mechanical polishing Solid State Technol. 35 5 87 93
    • (1992) Solid State Technol. , vol.35 , pp. 87-93
    • Sivaram, S.1
  • 5
    • 0025417082 scopus 로고
    • Chemical processes in glass polishing
    • LM Cook 1990 Chemical processes in glass polishing J. Non-Cryst. Solid 120 152 171
    • (1990) J. Non-Cryst. Solid , vol.120 , pp. 152-171
    • Cook, L.M.1
  • 6
    • 0026204737 scopus 로고
    • A two-dimensional process model for chemical-mechanical polish planarization
    • 8
    • J Warnock 1991 A two-dimensional process model for chemical-mechanical polish planarization J. Electrochem. Soc. 138 8 2398 2402
    • (1991) J. Electrochem. Soc. , vol.138 , pp. 2398-2402
    • Warnock, J.1
  • 7
    • 0028444787 scopus 로고
    • Tribology analysis of chemical-mechanical polishing
    • 6
    • SR Runnels LM Eyman 1994 Tribology analysis of chemical-mechanical polishing J. Electrochem. Soc. 141 6 1689 1701
    • (1994) J. Electrochem. Soc. , vol.141 , pp. 1689-1701
    • Runnels, S.R.1    Eyman, L.M.2
  • 8
    • 0028465918 scopus 로고
    • Feature-scale fluid-based erosion modeling for chemical-mechanical polishing
    • 7
    • SR Runnels 1994 Feature-scale fluid-based erosion modeling for chemical-mechanical polishing J. Electrochem. Soc. 141 7 1900 1904
    • (1994) J. Electrochem. Soc. , vol.141 , pp. 1900-1904
    • Runnels, S.R.1
  • 9
    • 0006247470 scopus 로고
    • Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing
    • SR Runnels P Renteln 1993 Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing Dielectric Sci. Technol. 6 110 121
    • (1993) Dielectric Sci. Technol. , vol.6 , pp. 110-121
    • Runnels, S.R.1    Renteln, P.2
  • 10
    • 0028552648 scopus 로고
    • Effect of polishing pad material properties on chemical mechanical polishing (CMP) process
    • R Bajaj 1994 Effect of polishing pad material properties on chemical mechanical polishing (CMP) process Mater. Res. Soc. Symp. Proc. 337 637 644
    • (1994) Mater. Res. Soc. Symp. Proc. , vol.337 , pp. 637-644
    • Bajaj, R.1
  • 11
    • 0030402263 scopus 로고    scopus 로고
    • Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films
    • WT Tseng CE Liu BT Dai CF Yeh 1996 Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films Thin Solid Films 290-291 458 463
    • (1996) Thin Solid Films , vol.290-291 , pp. 458-463
    • Tseng, W.T.1    Liu, C.E.2    Dai, B.T.3    Yeh, C.F.4
  • 12
    • 0006158961 scopus 로고    scopus 로고
    • Numerical flow visualization of slurry in a chemical mechanical planarization process
    • Bramono, D.P.Y., Racz, L.M.: Numerical flow visualization of slurry in a chemical mechanical planarization process. CMP-MIC Conference, pp. 185-192 (1998)
    • (1998) CMP-MIC Conference , pp. 185-192
    • Bramono, D.P.Y.1    Racz, L.M.2
  • 15
    • 0036604199 scopus 로고    scopus 로고
    • A material removal model for polishing glass-ceramic and aluminum magnesium storage disks
    • CC Wang SC Lin H Hochen 2002 A material removal model for polishing glass-ceramic and aluminum magnesium storage disks Int. J. Machine Tool Manuf. 42 979 984
    • (2002) Int. J. Machine Tool Manuf. , vol.42 , pp. 979-984
    • Wang, C.C.1    Lin, S.C.2    Hochen, H.3
  • 16
    • 0020253224 scopus 로고
    • Optical polishing of metals: contemporary methods in optical fabrication
    • NJ Brown 1981 Optical polishing of metals: contemporary methods in optical fabrication SPIE 306 42
    • (1981) SPIE , vol.306 , pp. 42
    • Brown, N.J.1
  • 17
    • 0027889065 scopus 로고
    • A statistical polishing pad model for chemical mechanical polishing
    • Yu, T.K., Yu, C.C., Orlowski, M.: A statistical polishing pad model for chemical mechanical polishing. IEDM Technol. Dig. 865-868 (1993)
    • (1993) IEDM Technol. Dig. , pp. 865-868
    • Yu, T.K.1    Yu, C.C.2    Orlowski, M.3
  • 18
    • 33947220921 scopus 로고    scopus 로고
    • An analytical model of the material removal rate between elastic and elastic-plastic deformation for polishing process
    • TR Lin 2007 An analytical model of the material removal rate between elastic and elastic-plastic deformation for polishing process Int. J. Adv. Manuf. Technol. 32 675 681
    • (2007) Int. J. Adv. Manuf. Technol. , vol.32 , pp. 675-681
    • Lin, T.R.1
  • 20
    • 0345476789 scopus 로고    scopus 로고
    • Wear by hard particles
    • 10
    • K-HZ Gahr 1998 Wear by hard particles Tribiol. Int 31 10 587 596
    • (1998) Tribiol. Int , vol.31 , pp. 587-596
    • Gahr, K.-Hz.1
  • 21
    • 4243377747 scopus 로고    scopus 로고
    • Wear modeling: analytical, computational and mapping: a continuum mechanics approach
    • JA Williams 1999 Wear modeling: analytical, computational and mapping: a continuum mechanics approach Wear 225-229 1 17
    • (1999) Wear , vol.225-229 , pp. 1-17
    • Williams, J.A.1
  • 22
    • 18144444813 scopus 로고    scopus 로고
    • Transition between two-body and three-body abrasive wear: influence of test conditions in the microscale abrasive wear test
    • RI Trezona DN Allsopp IM Hutchings 1999 Transition between two-body and three-body abrasive wear: influence of test conditions in the microscale abrasive wear test Wear 225-229 205 214
    • (1999) Wear , vol.225-229 , pp. 205-214
    • Trezona, R.I.1    Allsopp, D.N.2    Hutchings, I.M.3
  • 23
    • 0043131816 scopus 로고    scopus 로고
    • Wear-mode mapping for the micro-scale abrasion test
    • K Adachi IM Hutchings 2003 Wear-mode mapping for the micro-scale abrasion test Wear 255 23 29
    • (2003) Wear , vol.255 , pp. 23-29
    • Adachi, K.1    Hutchings, I.M.2
  • 24
    • 33746876708 scopus 로고    scopus 로고
    • Finishing of structured surfaces by abrasive polishing
    • E Brinksmeier O Riemer A Gessenharter 2006 Finishing of structured surfaces by abrasive polishing Precis. Eng. 30 325 336
    • (2006) Precis. Eng. , vol.30 , pp. 325-336
    • Brinksmeier, E.1    Riemer, O.2    Gessenharter, A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.