Optical applications of silicon micromachining technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3223, Issue , 1997, Pages 120-129

  Trott, G ^a   Yang, L ^a   Carey, K ^a   Ratowsky, R ^b   Kallman, J S ^b  

^a HEWLETT PACKARD LABORATORIES   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

Ball lenses; Laser packaging; Laser submounts; Lasers; Optoelectonic packaging; Silicon optical bench

Indexed keywords

ASPHERIC LENSES; BALL LENSES; BASE PLATFORMS; BATCH ASSEMBLIES; BATCH PROCESSES; DIMENSIONAL STRUCTURES; FIBER COUPLINGS; GAUSSIAN METHODS; HERMETIC PACKAGES; KEY COMPONENTS; LASER LIGHTS; MATERIAL PROPERTIES; MICRO PARTS; OPTICAL APPLICATIONS; OPTICAL ASSEMBLIES; OPTICAL BENCHES; OPTICAL FUNCTIONS; OPTICAL PARTS; OPTICAL PRODUCTS; OPTICAL-; OPTOELECTONIC PACKAGING; PERFORMANCE LEVELS; PLATFORM TECHNOLOGIES; PROCESSING TECHNOLOGIES; SILICON MICROMACHINING TECHNOLOGIES; SILICON OPTICAL BENCH; SMALL SIZES; SPHERICAL ABERRATIONS; SPHERICAL COORDINATES;

ASSEMBLY; BATCH DATA PROCESSING; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; LASERS; LENSES; MACHINING; MAXWELL EQUATIONS; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; NONMETALS; OPTICAL INSTRUMENTS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SPHERES; TECHNOLOGY; THREE DIMENSIONAL;

OPTICAL COLLIMATORS;

EID: 57649229387     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284472     Document Type: Conference Paper

References (11)

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