Technology developments to initiate a next generation of Cochlear Implants

Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings

Volumn , Issue , 2007, Pages 515-518

  Volckaerts, B ^b   Corless, A R ^a   Mercanzini, A ^c   Silmon, A M ^d   Bertsch, A ^c   Van Himbeeck, C ^b   Wasikiewicz, J ^e   Bulcke, M Vanden ^f   Vadgama, P ^e   Renaud, P ^c   Corless, Tony ^d  

^a IEEE

^b Research and Development   (Belgium)

^c EPFL   (Switzerland)

^d NEWCASTLE UNIVERSITY   (United Kingdom)

^e QUEEN MARY UNIVERSITY OF LONDON   (United Kingdom)

^f IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODES; IMPLANTS (SURGICAL); INTERFACES (MATERIALS); PROJECT MANAGEMENT;

COCHLEAR IMPLANTS; ELECTRODE INTERFACES;

BIOMEDICAL ENGINEERING;

COCHLEA PROSTHESIS; HEARING LOSS; HUMAN; REVIEW;

COCHLEAR IMPLANTS; HEARING LOSS, BILATERAL; HUMANS;

EID: 57649229208     PISSN: 05891019     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMBS.2007.4352338     Document Type: Conference Paper

References (3)

1. D. Szmigiel, Krzysztof Domanski, P. Prokaryn and P. Grabiec, "Deep etching of biocompatible silicone rubber," Microelectron. Eng., vol. 83, pp. 1178-1181, 2006.
2. M. Vanden Bulcke, K. Baert, E. Beyne, M. Gonzalez, C. Winters and T. Webers. "Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier", in Proc. 28th IEEE EMBS Ann. Int. Conf., New York City, 2006, pp. 2811-2815.
3. th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS), Kobe, Japan, 2007.