Thermal management in planar optical systems with active components

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3226, Issue , 1997, Pages 56-66

  Gimkiewicz, C ^a   Jahns, J ^a  

^a UNIVERSITY OF HAGEN   (Germany)

Author keywords

Heat removal; Packaging; Planar optics; VCSEL

Indexed keywords

CHIP SCALE PACKAGES; MICROELECTRONIC PROCESSING; MICROELECTRONICS; MICROOPTICS; OPTICAL COMMUNICATION; OPTICAL WAVEGUIDES; PACKAGING; SUBSTRATES; THERMAL CONDUCTIVITY; TRANSCEIVERS;

HEAT REMOVAL; HIGH THERMAL CONDUCTIVITY; INTEGRATED FREE-SPACE OPTICS; INTERCONNECTION DENSITY; OPTOELECTRONIC COMPONENTS; PLANAR OPTICAL SYSTEMS; PLANAR OPTICS; SINGLE GLASS SUBSTRATES;

SURFACE EMITTING LASERS;

EID: 57649193555     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284574     Document Type: Conference Paper

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