A microsystem integration platform dedicated to build multi-chip neural interfaces

Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings

Volumn , Issue , 2007, Pages 6604-6607

  Ayoub, Amer E ^a   Gosselin, Benoit ^a   Sawan, Mohamad ^a  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC DISCHARGE MACHINING; INTEGRATED CIRCUITS; MICROSYSTEMS; SIGNAL PROCESSING;

DIE STACKING; MICROPROBES; SYSTEM-IN-PACKAGE;

INTERFACES (COMPUTER);

EID: 57649180417     PISSN: 05891019     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMBS.2007.4353873     Document Type: Conference Paper

References (11)

1. M. Sawan, Y. Hu, and J. Coulombe, "Wireless smart implants dedicated to multichannel monitoring and microstimulation," IEEE Circuits and Systems Magazine, vol. 5, pp. 21-39, 2005.
2. R. R. Harrison, P. T. Watkins, R. J. Kier, R. O. Lovejoy, D. J. Black, B. Greger, and F. Solzbacher, "A low-power integrated circuit for a wireless 100-electrode neural recording system," Solid-State Circuits, IEEE Journal of vol. 42, no. 1, pp. 123-133, Jan. 2007.
3. M. Töpper, M. Klein, K. Buschick, V. Glaw, K. Orth, O. Ehrmann, M. Hutter, H. Oppermann, K.-F. Becker, T. Braun, F. Ebling, H. Reichl, S. Kim, P. Tathireddy, S. Chakravarty, and F. Solzbacher, "Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces," in Electronic Components and Technology Conference, 2006. Proceedings. 56th, 30 May-2 June 2006, pp. 705-708.
4. R. Olsson and K. Wise, "A three-dimensional neural recording microsystem with implantable data compression circuitry," in Solid-Stale Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International, 6-10 Feb. 2005, pp. 558-559Vol.1.
5. T. Fofonoff, S. Martel, N. Hatsopoulos, J. Donoghue, and I. Hunter, "Microelectrode array fabrication by electrical discharge machining and chemical etching," Biomedical Engineering, IEEE Transactions on, vol. 51, no. 6, pp. 890-895, June 2004.
6. C. H. Inc, "Biodur® type 3161s stainless," April 15th 2007, http://www.cartech.com/.
7. S. Pigeon, "Conception et fabrication d'une matrice de microElectrodes corticales implantables," Mémoire de maîtrise en génie électrique, École Polytechnique de Montréal, Avril 2004.
8. H. Hocheng, P. Kao, and Y. Chen, "Electropolishing of 3161 stainless steel for anticorrosion passivation," Journal of Materials Engineering and Performance, vol. 10, no. 4, pp. 414-418, August 2001.
9. M. Gerber and M. Dreiza, "Stacked-chip-scale-package-design guidelines," EDN (US Edition), vol. 51, pp. 79-84, June 2006.
10. LASEM, "Laboratoire d'assemblage et d'encapsulation de microsystemes électroniques (LASEM)," Ecole Polytechnique de Montreal, April 11th 2007, http://www.polymtl.ca/recherche/rc/unites/details.php?NoUnite=136.
11. T. Fofonoff, C. Wiseman, R. Dyer, J. Malasek, J. Burgert, S. Martel, I. Hunter, N. Hatsopoulos, and J. Donoghue, "Mechanical assembly of a microelectrode array for use in a wireless intraeortical recording device," in Microtechnologies in Medicine & Biology 2nd Annual International IEEE-EMB Special Topic Conference on, 2-4 May 2002, pp. 269-272.