Reliability characterization of organic ultra low k film using ramp voltage breakdown

Proceedings - Electrochemical Society

Volumn 10, Issue , 2003, Pages 232-236

  Krishnamoorthy, Ahila ^a   Murthy, B Ramana ^a   Yiang, K Y ^b   Yoo, W J ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL DAMAGE; MOISTURE ABSORPTION; SURFACE PLASMA DAMAGE; ULTRA LOW K (ULK) FILMS;

CAPACITORS; COMPUTER SIMULATION; DIELECTRIC LOSSES; ELECTRIC BREAKDOWN; HUMIDITY CONTROL; LEAKAGE CURRENTS; ORGANIC COMPOUNDS; OXIDATION; PERMITTIVITY; PHOTORESISTORS; PLASMA ETCHING; THERMODYNAMIC STABILITY; WSI CIRCUITS;

ULTRATHIN FILMS;

EID: 5744237867     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. J. J. Waterloos et al, IITC 2001, IEEE, p. 253
2. M.R. Baklanov, S. Vanhaelemeersch, H. Bender, and K. Maex, Journal of Vacuum Sci. Technol. B, 17 (2) pp. 372-379
3. C.-F. Yen, Y.-C. Lee, Y.-C. Su, K.-H. Wu, C.-H. Lin, Proc. Intl. Symp. on plasma Process-Induced Damage, American Vacuum Society, 2000, pp. 81-84
4. G. Maier, Progress in Polymer Science 26 (2001), pp 3-65