Al-SiC powder preparation for electronic packaging aluminum composites by plasma spray processing

Journal of Thermal Spray Technology

Volumn 13, Issue 2, 2004, Pages 214-222

  Gui, Manchang ^a,b   Kang, Suk Bong ^b   Euh, Kwangjun ^b  

^a BEIJING INSTITUTE OF AERONAUTICAL MATERIALS   (China)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Aluminum matrix composite; Ball milling; Plasma spraying; Powder; Silicon carbide particle

Indexed keywords

ALUMINUM; BALL MILLING; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; METALLIC MATRIX COMPOSITES; MICROSTRUCTURE; MORPHOLOGY; POWDERS; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; STAINLESS STEEL; ZIRCONIA;

ALUMINUM MATRIX COMPOSITE; CONVENTIONAL ROTATING BALL MILL; POWDER PREPARATION;

PLASMA SPRAYING;

EID: 3142698239     PISSN: 10599630     EISSN: None     Source Type: Journal    
DOI: 10.1361/10599630418130     Document Type: Article

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