Copper nucleation on platinum in the presence of additives in acid-copper solution

Proceedings - Electrochemical Society

Volumn 10, Issue , 2003, Pages 63-78

  Han, Jianwen ^a   King, Mackenzie ^a   Stawasz, Michele ^a   Baum, Thomas ^a  

^a ENTEGRIS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ANALYSIS; ADDITIVES; ATOMIC FORCE MICROSCOPY; COPPER COMPOUNDS; ELECTRODES; GALVANIZING; NUCLEATION; PLATINUM; THIN FILMS;

ACID-COPPER SOLUTION; COPPER NUCLEATION; MOORE'S LAW; POTENTIAL-CONTROLLED PROCESSES;

INTEGRATED CIRCUITS;

EID: 5744224163     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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