High temperature interface reactions of TiC, TiN, and SiC with palladium and rhodium

Solid State Ionics

Volumn 179, Issue 39, 2008, Pages 2313-2321

  Demkowicz, Paul ^a   Wright, Karen ^a   Gan, Jian ^a   Petti, David ^a  

^a IDAHO NATIONAL LABORATORY   (United States)

Author keywords

Interface reactions; Palladium; Rhodium; Silicon carbide; Titanium carbide; Titanium nitride

Indexed keywords

ANNEALING; BUILDING MATERIALS; CERAMIC MATERIALS; ELECTRON PROBE MICROANALYSIS; MICROANALYSIS; MICROSCOPIC EXAMINATION; NITRIDES; PALLADIUM; PLATINUM; PLATINUM METALS; RHODIUM; SILICON; SILICON CARBIDE; TEMPERATURE INDICATING CAMERAS; TIN; TITANIUM; TITANIUM CARBIDE; TITANIUM COMPOUNDS; TITANIUM NITRIDE; TRANSITION METALS;

ANNEALING TIMES; BULK DIFFUSIONS; HIGH TEMPERATURES; INTERFACE REACTIONS; INTERMETALLIC PHASE; INTERMETALLIC PHASIS; METAL INTERFACES; PARABOLIC BEHAVIORS; PLATINUM GROUP METALS;

PHASE INTERFACES;

EID: 56949084028     PISSN: 01672738     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ssi.2008.07.021     Document Type: Article

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