Morphology and thermal and dielectric behavior of cycloaliphatic epoxy/trimethacrylate interpenetrating polymer networks for vacuum-pressure- impregnation electrical insulation

Journal of Applied Polymer Science

Volumn 110, Issue 5, 2008, Pages 3096-3106

  Duan, Jingkuan ^a   Kim, Chonung ^a,b   Yun, Zheng ^a   Jiang, Pingkai ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b KIM CHAEK UNIVERSITY OF TECHNOLOGY   (North Korea)

Author keywords

Curing of polymers; Interpenetrating polymer networks (IPN); Networks

Indexed keywords

ANHYDRIDE SYSTEMS; ATOMIC FORCES; COMPACT MICROSTRUCTURES; CURED EPOXIES; CURING OF POLYMERS; CYCLOALIPHATIC EPOXY RESINS; DIELECTRIC ANALYSES; DIELECTRIC BEHAVIORS; DYNAMIC MECHANICALS; ELECTRIC MACHINES; ELECTRICAL INSULATIONS; IN-SITU; INTERPENETRATING POLYMER NETWORKS (IPN); INTERPENETRATING POLYMERS; NETWORKS; SEQUENTIAL INTERPENETRATING POLYMER NETWORKS; THERMAL DECOMPOSITIONS; THERMAL STABILITIES; TRIMETHACRYLATE; TRIMETHYLOL; VACUUM PRESSURE IMPREGNATIONS; WIDE FREQUENCY RANGES; WIDE TEMPERATURE RANGES;

ABS RESINS; CURING; DECOMPOSITION; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; ELECTRIC MACHINERY; GRAVIMETRIC ANALYSIS; IMPREGNATION; INTERPENETRATING POLYMER NETWORKS; MICROSTRUCTURE; MONOMERS; POLYMERS; PROPANE; PYROLYSIS; RESINS; STABILITY; SYSTEM STABILITY; THERMAL INSULATION; THERMOGRAVIMETRIC ANALYSIS; VACUUM;

EPOXY RESINS;

CURING (CHEMISTRY); DIELECTRIC PROPERTY; ELECTRICAL PROPERTY; IMPREGNATING; INSULATION; MORPHOLOGY; POLYMER; RESIN; THERMAL PROPERTY; THERMOGRAVIMETRY;

EID: 56749161291     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.28835     Document Type: Article

References (28)

1. Edward, A. B.; Stone, G. C. IEEE Electr Insul Mag 2004, 20, 25.
2. Weege, T. Proc Electr/Electron Insul Conf, Sept 22-25, 1997, 709.
3. Fazio, C. Proc Electr/Electron Insul Conf, Sept 22-25, 1997, 753.
4. Lee, K. Y.; Lee, K. W.; Choi, Y. S.; Park, D. H. IEEE Trans Dielectr Electr Insul 2005, 12, 566.
5. Joseph, R. N.; Balaji, N. Polymer 2006, 47, 1108.
6. Boey, F.; Lath, S. K.; Ng, A. K.; Abadie, M. J. M. J Appl Polym Sci 2002, 86, 518.
7. Teil, H.; Page, S. A.; Michaud, V.; Manson, J. A. E. J Appl Polym Sci 2004, 93, 1774.
8. Zhuqing, Z.; Wong, C. P. J Appl Polym Sci 2002, 86, 1572.
9. Smith, J. D. B. J Appl Polym Sci 1981, 26, 979.
10. Dean, K.; Cook, W. D.; Burchill, P.; Zipper, M. Polymer 2001, 42, 3589.
11. Montserrat, S.; Andreu, G.; Cortes, P.; Calventus, Y.; Colomer, P.; Huntchinson, J. M.; Malek, J. J Appl Polym Sci 1996, 61, 1663.
12. Cortes, P.; Montserrat, S.; Huntchinson, J. M. J Appl Polym Sci 1997, 63, 17.
13. Nunez-Regueira, L.; Villanueva, M.; Fraga-Rivas, I. J Therm Anal Calorim 2006, 86, 463.
14. Ali, M.; Hammami, A. Polym Compos 2005, 26, 593.
15. Joseph, R. N.; Balaji, N. Polymer 2006, 47, 1108.
16. Duan, J.; Kim, C.; Jiang, P. J Polym Res, to appear.
17. Park, S.-J.; Kwak, G.-H.; Sumita, M.; Lee, J.-R. Polym Eng Sci 2000, 40, 2569.
18. Galy, J.; Sabra, A.; Pascault, J.-P. Polym Eng Sci 1986, 26, 1514.
19. Lee, D. G.; Kim, H. G. J Compos Mater 2004, 12, 977.
20. Liming, Z.; Leo, C. K.; Martin, C. H. Polymer 2005, 46, 2638.
21. Yangyang, S.; Zhuqing, Z.; Wang, C. P. Polymer 2005, 46, 2297.
22. Guo, Z.; Warner, J.; Christy, P.; Kranbuehl, D. E.; Boiteux, G.; Seytre, G. Polymer 2004, 45, 8825.
23. Smith, J. D. B.; Kauffman, R. N. IEEE Trans Electr Insul 1984, 19, 33.
24. Dusek, K.; Matejka, L.; Spacek, P.; Winter, H. Polymer 1996, 37, 2233.
25. Qin, C.-L.; Cai, W.-M.; Cai, J.; Tang, D.-Y.; Zhang, J.-S.; Qin, M. Mater Chem Phys 2004, 85, 402.
26. Dean, K. M.; Cook, W. D.; Lin, M. Y. Eur Polym J 2006, 42, 2872.
27. Tobolsky, A. V. Properties and Structure of Polymers; Wiley: New York, 1960.
28. Kremer, F.; Schonhals, A. Broadband Dielectric Spectroscopy; Springer-Verlag: Berlin, 2002.