Improved thermal, structural and electrical properties of epoxy for use at high voltages

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 12, Issue 3, 2005, Pages 566-572

  Lee, Kyoung Yong ^a   Lee, Kwan Woo ^a   Choi, Yong Sung ^a   Park, Dae Hee ^a   Lim, Kee Joe ^b  

^a Wonkwang University   (South Korea)

^b Chungbuk National University   (South Korea)

Author keywords

Elastic epoxy; Elastic factor; Glass transition temperature; High impact; High temperature

Indexed keywords

DYNAMIC MECHANICAL ANALYSIS; ELASTICITY; ELASTOMERS; ELECTRIC PROPERTIES; GLASS TRANSITION; HIGH TEMPERATURE EFFECTS; SCANNING ELECTRON MICROSCOPY; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS; VOLTAGE MEASUREMENT;

ELASTIC EPOXY; ELASTIC-FACTOR; HIGH IMPACT; STRUCTURAL PROPERTIES;

EPOXY RESINS;

EID: 22744432047     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2005.1453461     Document Type: Article

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