Anti-plane crack intersecting the interface in a bonded smart structure with graded magnetoelectroelastic properties

Theoretical and Applied Fracture Mechanics

Volumn 50, Issue 3, 2008, Pages 235-242

  Li, Y D ^a,b   Lee, K Y ^b  

^a NATIONAL KEY LABORATORY FOR REMANUFACTURING   (China)

^b Yonsei University   (South Korea)

Author keywords

Energy density factor; Functionally graded materials; Interface intersecting crack; Magnetoelectroelastic material; Smart structure

Indexed keywords

COMPOSITE MICROMECHANICS; FOURIER SERIES; FOURIER TRANSFORMS; FRACTURE; FUNCTIONALLY GRADED MATERIALS; INTEGRAL EQUATIONS; INTELLIGENT STRUCTURES; MECHANICAL PROPERTIES; PIEZOELECTRIC ACTUATORS;

AUXILIARY FUNCTIONS; CONTINUITY CONDITIONS; EDGE CRACKS; ENERGY DENSITY FACTOR; ENERGY DENSITY FACTORS; FOURIER INTEGRAL TRANSFORMS; FRACTURE ANALYSES; GEOMETRICAL PARAMETERS; INTERFACE-INTERSECTING CRACK; KEY TECHNIQUES; MAGNETOELECTROELASTIC MATERIAL; MAGNETOELECTROELASTIC PROPERTIES; MECHANICAL MODELS; NUMERICAL RESULTS; PLANE CRACKS; SMART STRUCTURE; SMART STRUCTURES; SYSTEM OF SINGULAR INTEGRAL EQUATIONS; TREATMENT METHODS;

CRACKS;

EID: 56749150926     PISSN: 01678442     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tafmec.2008.07.011     Document Type: Article

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