Design and thermal shock performance of W/Cu functionally graded material used as plasma facing component

Materials Science Forum

Volumn 423-425, Issue , 2003, Pages 49-54

  Ling, Yunhan ^a   Bai, Xinde ^a   Ge, Changchun ^b  

^a TSINGHUA UNIVERSITY   (China)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Finite element analysis; Plasma facing material; Thermal stress; Tungsten

Indexed keywords

COPPER; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FUNCTIONALLY GRADED MATERIALS; PLASMAS; QUENCHING; REDUCTION; SPUTTERING; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMAL STRESS; WELDABILITY;

PLASMA FACING COMPONENT; TEMPERATURE GAP; THERMAL SHOCK RESISTANCE; WATER QUENCHING;

TUNGSTEN;

EID: 0038470024     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.423-425.49     Document Type: Conference Paper

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