Numerical and experimental thermal characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 385-390

  Moores, Kevin A ^a   Joshi, Yogendra K ^a   Schiroky, Gerhard ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; COMPUTATIONAL FLUID DYNAMICS; FINS (HEAT EXCHANGE); HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; METALLIC MATRIX COMPOSITES; PRESSURE DROP; TEST FACILITIES; THERMOANALYSIS; WATER;

ALUMINUM SILICON CARBIDE METAL MATRIX COMPOSITE; CLOSED LOOP TEST FACILITY; HYDRODYNAMIC RESISTANCE; INTEGRAL PIN FINS; THERMAL MANAGEMENT;

POWER ELECTRONICS;

EID: 0033709711     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)