The effect of twin plane spacing on the deformation of copper containing a high density of growth twins

JOM

Volumn 60, Issue 9, 2008, Pages 71-74

  Shan, Z W ^a,e   Lu, L ^b   Minor, Andrew M ^a,c   Stach, E A ^d   Mao, Scott X ^e  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^b INSTITUTE OF METAL RESEARCH   (China)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d PURDUE UNIVERSITY   (United States)

^e PA 15260   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; MECHANISMS; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; TRANSMISSION ELECTRON MICROSCOPY;

CRACK PROPAGATION PATHS; DEFORMATION AND FRACTURES; DEFORMATION MECHANISMS; HIGH DENSITIES; IN-SITU; MECHANICAL BEHAVIORS; NANOSCALE GROWTH TWINS; PURE COPPERS; TRANSMISSION ELECTRON MICROSCOPES; TWIN PLANES;

DEFORMATION;

EID: 56349153302     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-008-0122-z     Document Type: Review

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