Microstructural characterizations of Cu processed by ECAP from 4 to 24 passes

Materials Science Forum

Volumn 584-586 PART 1, Issue , 2008, Pages 333-337

  Huang, C X ^a   Yang, H J ^a   Wu, S D ^a   Zhang, Z F ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Cu; ECAP; Microstructure; UFG

Indexed keywords

COPPER; GRAIN BOUNDARIES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; PRESSING (FORMING); RECOVERY; TEXTURES;

DISLOCATION CELLS; DYNAMIC RECOVERY; ECAP; HIGH ANGLE GRAIN BOUNDARIES; MICRO-STRUCTURAL CHARACTERIZATION; MISORIENTATIONS; UFG MICROSTRUCTURE; ULTRA FINE GRAINED MICROSTRUCTURE;

EQUAL CHANNEL ANGULAR PRESSING;

EID: 56349143821     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.584-586.333     Document Type: Conference Paper

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