Undercooling and unidirectional solidification of CuNi alloy melts

Chinese Physics Letters

Volumn 25, Issue 10, 2008, Pages 3808-3810

  Wang, Qiang ^a   Ma, Ming Zhen ^a   Jing, Qin ^a   Li, Gong ^a   Qi, Li ^a   Zhang, Xin Yu ^a   Wang, Wen Kui ^a   Liu, Ri Ping ^a  

^a YANSHAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; ELECTROMAGNETIC PROPULSION; LEVITATION MELTING; MAGNETIC LEVITATION;

ALLOY MELT; BOTTOM ENDS; CONSTANT TEMPERATURE; CU -NI ALLOYS; ELECTROMAGNETIC LEVITATION; LEVITATION TECHNIQUES; TREATMENT METHODS; UNDERCOOLING SOLIDIFICATION; UNDERCOOLINGS; UNIDIRECTIONAL SOLIDIFICATION;

UNDERCOOLING;

EID: 56349100226     PISSN: 0256307X     EISSN: 17413540     Source Type: Journal    
DOI: 10.1088/0256-307X/25/10/079     Document Type: Article

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