Solidification behavior of undercooled Cu70Ni30 alloy melt

Materials Science and Engineering: A

Volumn 277, Issue 1-2, 2000, Pages 161-168

  Li, J F ^a   Zhou, Y H ^a   Yang, G C ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Directional solidification; Growth velocity; Structure evolution; Undercooled melt

Indexed keywords

COOLING; CRYSTAL GROWTH; GRAIN SIZE AND SHAPE; HIGH SPEED PHOTOGRAPHY; LIQUID METALS; MATHEMATICAL MODELS; NUCLEATION; RECRYSTALLIZATION (METALLURGY); SOLIDIFICATION; STRESS ANALYSIS; THERMAL DIFFUSION; THERMAL EFFECTS;

DENDRITES;

COPPER ALLOYS;

EID: 0033896869     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(99)00532-8     Document Type: Article

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