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RIE of SiO2 was performed with CHF3 / O2 / CF4 gas mixture (25/5/50 SCCM) and 50 W rf power.
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RIE of SiO2 was performed with CHF3 / O2 / CF4 gas mixture (25/5/50 SCCM) and 50 W rf power.
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9
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56249132203
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Certain commercial equipments or material suppliers are identified in this paper for describing experimental procedure adequately. This does not imply endorsement by NIST.
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Certain commercial equipments or material suppliers are identified in this paper for describing experimental procedure adequately. This does not imply endorsement by NIST.
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10
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56249090798
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Carrier concentration and resistivity data of a -Si as a function of diffusion temperature and time was generated by depositing a -Si on sapphire substrate and utilizing Hall effect and four-point resistivity measurements to characterize its electrical properties. The diffusion process with temperature ranging from 750 to 850 °C for 15 min resulted in -doping density in a -Si in the range of 5× 1019 -4× 1020 cm-3 and hole mobility in the range of 5-2 cm2 V-1 s-1. Diffusion time of 15 min resulted in a uniform dopant profile as confirmed by depth profiling, where resistivity was measured as the film was etched in regular steps. It is worth mentioning that after diffusion, XRD revealed the onset of crystallization in a -Si layer.
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Carrier concentration and resistivity data of a -Si as a function of diffusion temperature and time was generated by depositing a -Si on sapphire substrate and utilizing Hall effect and four-point resistivity measurements to characterize its electrical properties. The diffusion process with temperature ranging from 750 to 850 °C for 15 min resulted in p -doping density in a -Si in the range of 5× 1019 -4× 1020 cm-3 and hole mobility in the range of 5-2 cm2 V-1 s-1. Diffusion time of 15 min resulted in a uniform dopant profile as confirmed by depth profiling, where resistivity was measured as the film was etched in regular steps. It is worth mentioning that after diffusion, XRD revealed the onset of crystallization in a -Si layer.
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11
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56249086922
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RIE of Si was performed with CHF3 / CF4 /Ar gas mixture (25/50/10 SCCM) and 250 W rf power.
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RIE of Si was performed with CHF3 / CF4 /Ar gas mixture (25/50/10 SCCM) and 250 W rf power.
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