Flexible organic light-emitting diodes using a metal peel-off method

IEEE Photonics Technology Letters

Volumn 20, Issue 22, 2008, Pages 1836-1838

  Kim, Soo Young ^a,b   Kim, Kisoo ^b   Hong, Kihyon ^b   Lee, Jong Lam ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

Adhesive force; Flexible devices; Organic light emitting diodes (OLEDs); Peel off; Work of adhesion

Indexed keywords

DIODES; GLASS; LIGHT EMISSION; LIGHT EMITTING DIODES; METALLIC COMPOUNDS; SILVER;

ADHESIVE FORCE; FLEXIBLE DEVICES; ORGANIC LIGHT-EMITTING DIODES (OLEDS); PEEL-OFF; WORK OF ADHESION;

ORGANIC LIGHT EMITTING DIODES (OLED);

EID: 56049084914     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2008.2004693     Document Type: Article

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