Influence of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 10, 2008, Pages 5-8

  Sun, Fenglian ^a   Hu, Wengang ^a   Wang, Lifeng ^a   Ma, Xin ^b  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Yik Shing Tat Industrial Co Ltd   (China)

Author keywords

Fillet lifting; Lead free solder; Melting point; Wettability

Indexed keywords

ABS RESINS; BRAZING; COPPER; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; LASER INTERFEROMETRY; LEAD; MELTING; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STEELMAKING; THERMOCHEMISTRY; TIN; TIN ALLOYS; WELDING;

COMPREHENSIVE PROPERTIES; EXCESS ELEMENTS; FILLET LIFTING; LEAD-FREE SOLDER; LEAD-FREE SOLDERS; MELTING RANGES; WETTABILITY; WETTING BALANCES;

MELTING POINT;

EID: 55949118149     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

1. Mulugeta A, Guna S. Lead-free solders in micro-electronics[J]. Materials Science and Engineering, 2000, 27(5-6): 95-141.
2. Pang J H L, Xiong B S, Low T H. Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy[J]. International Journal of Fatigue, 2004, 26(8): 865-872.
3. Sargent P M, Tang A C T, Gordon F H. An experimental study of the variation of wettability of SMDs using the micro-global wetting method[C]//Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium. IEEE CHMT Eur Int Electron Manuf Technol Symp. USA: IEEE, 1991: 166-170.
4. Bukat K, Sitek J. Solderability evaluation of no-VOC flux Pb-free solder[J]. Global SMT and Packaging China, 2003, 3(2): 11-15.