Micromechanical responses of Sn-3.5Ag-xCo lead-free solders by nanoindentation

Materials Science Forum

Volumn 580-582, Issue , 2008, Pages 209-212

  Gao, Feng ^a   Nishikawa, Hiroshi ^a   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Isothermal aging; Lead free solder; Nanoindentation; Sn 3.5Ag; Strain rate sensitivity

Indexed keywords

BINARY ALLOYS; COARSENING; COBALT ALLOYS; CREEP; ELASTIC MODULI; GRAIN GROWTH; HARDNESS; ISOTHERMS; NANOINDENTATION; SILVER ALLOYS; STRAIN RATE; TERNARY ALLOYS; TIN ALLOYS; WELDING;

CONSTANT LOADS; CREEP DEFORMATIONS; ISOTHERMAL AGING; MICRO-MECHANICAL; SN-3.5AG; SOLDER ALLOYS; STRAIN RATE SENSITIVITY; STRAIN RATE SENSITIVITY INDEX;

LEAD-FREE SOLDERS;

EID: 55849135828     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.580-582.209     Document Type: Conference Paper

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