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Volumn 57, Issue 1, 2009, Pages 56-68
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Peritectic solidification of Cu-Sn alloys: Microstructural competition at low speed
a
EPFL
(Switzerland)
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Author keywords
Cooperative growth; Copper alloys; Directional solidification; Nucleation and growth; Peritectic solidification
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Indexed keywords
COPPER;
COPPER ALLOYS;
CRYSTALLIZATION;
METALLIC COMPOUNDS;
SOLIDIFICATION;
TIN;
TIN ALLOYS;
BACK SCATTERED;
BRIDGMAN FURNACES;
COOPERATIVE GROWTH;
DIFFRACTION MEASUREMENTS;
DIRECTIONAL SOLIDIFICATION;
DIRECTIONAL SOLIDIFICATIONS;
LOW SPEEDS;
LOW VELOCITIES;
MACROSEGREGATION;
MICROSTRUCTURAL;
NUCLEATION AND GROWTH;
PERITECTIC ALLOYS;
PERITECTIC COMPOSITIONS;
PERITECTIC SOLIDIFICATION;
PERITECTIC SOLIDIFICATIONS;
SN ALLOYS;
ALLOYS;
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EID: 55749083693
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2008.08.058 Document Type: Article |
Times cited : (80)
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References (40)
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