Corrigendum to "Application of single pan thermal analysis to Cu-Sn peritectic alloys" [Acta Mater 56 (2008) 1519-1528] (DOI:10.1016/j.actamat.2007.12.006);Application of single pan thermal analysis to Cu-Sn peritectic alloys

Acta Materialia

Volumn 56, Issue 7, 2008, Pages 1519-1528

  Kohler, F ^a   Campanella, T ^a   Nakanishi, S ^a   Rappaz, M ^a  

^a EPFL   (Switzerland)

Author keywords

Copper alloys; Peritectic solidification; Thermal analysis; Thermodynamics

Indexed keywords

CALIBRATION; DATABASE SYSTEMS; PHASE DIAGRAMS; THERMOANALYSIS;

HEAT FLOW MODEL; PERITECTIC ALLOYS; PERITECTIC SOLIDIFICATION;

COPPER ALLOYS;

EID: 40849092487     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.04.038     Document Type: Erratum

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