Grain boundary engineering of copper shaped-charge liners

Materials Research Society Symposium - Proceedings

Volumn 819, Issue , 2004, Pages 51-56

  Blobaum, Kerri J M ^a   Stölken, James S ^a   Kumar, Mukul ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COPPER; DUCTILITY; GRAIN SIZE AND SHAPE; MELTING; SENSITIVITY ANALYSIS; STRAIN RATE; STRENGTH OF MATERIALS; TEXTURES; THERMAL EFFECTS;

MATERIAL DENSITY; MATERIAL PROPERTIES; SHAPED-CHARGE LINERS (SCL); TEXTURED MICROSTRUCTURE;

GRAIN BOUNDARIES;

EID: 5544239168     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-819-n3.27     Document Type: Conference Paper

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