Electromigration study of ultra narrow copper lines in low-k dielectric

Advanced Metallization Conference (AMC)

Volumn , Issue , 2008, Pages 711-715

  Croes, Kristof ^a   Jin, Moon Kwang ^a   Laureen, Carbonell ^a   Struyf, Herbert ^a   Heylen, Nancy ^a   Tokei, Zsolt ^a   Beyer, Gerald P ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTROMIGRATION; METALLIZING; SILICON CARBIDE; SILICON COMPOUNDS;

32 NM TECHNOLOGIES; COPPER LINES; DOWNSCALING; ELECTROMIGRATION BEHAVIORS; LIFE-TIMES; LOW-K DIELECTRICS;

COPPER;

EID: 55349089192     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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