Electrolytic deposition behaviors of Ni-SiC composite coatings containing submicron-sized SiC particles

Metals and Materials International

Volumn 14, Issue 5, 2008, Pages 599-605

  Lee, Hong Kee ^a   Lee, Ho Young ^b   Jeon, Jun Mi ^a  

^a Korea Institute of Industrial Technology   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Composite; Nickel; Plating; SiC; Submicron size

Indexed keywords

COMPOSITE COATINGS; COMPOSITE MATERIALS; DEPOSITION RATES; NICKEL; NICKEL COATINGS; NICKEL COMPOUNDS; PLATING; SILICON; SILICON CARBIDE;

DEPOSITION BEHAVIOR; ELECTROLYTIC PLATING; HYDRODYNAMIC EFFECT; ISO-ELECTRIC POINTS; NI-SIC COMPOSITE; PARTICLE CHARACTERISTICS; PLATING PARAMETERS; SUBMICRON SIZE;

SILICON COMPOUNDS;

EID: 55349086197     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.3365/met.mat.2008.10.599     Document Type: Article

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