Numerical investigations of smart card module: Parametric analysis and design optimization

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 3, 2008, Pages 464-470

  Su, M ^a   Boddaert, X ^a   Inal, K ^a  

^a Center Microelectronics De Provence Georges Charpak   (France)

Author keywords

Electronics; Finite element (FE) methods; Flexible structure; Reliability

Indexed keywords

ABS RESINS; BENDING (DEFORMATION); COPPER; DIES; FINITE ELEMENT METHOD; FLEXIBLE STRUCTURES; INTEGRATED CIRCUITS; RELIABILITY; RESINS; SILICON; STRESS CONCENTRATION; STRESSES;

ANSYS SOFTWARES; BENDING; BENDING STRESS DISTRIBUTIONS; BENDING STRESSES; COPPER THICKNESSES; DESIGN OPTIMIZATIONS; DIE PACKAGES; ELECTRONICS; FINITE-ELEMENT (FE) METHODS; FLEXIBLE; HIGH-PERFORMANCE; INTEGRATED CIRCUIT PACKAGES; MARKET DEMANDS; NUMERICAL INVESTIGATIONS; PARAMETRIC ANALYSIS; POINT BENDING; SILICON DIES; ULTRATHIN SILICONS; YOUNG'S MODULUS;

OPTIMIZATION;

EID: 54949145772     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.2002347     Document Type: Article

References (10)

1. E. Jung, A. Neumann, D. Wojakowski, A. Ostmann, C. Landesberger, R. Aschenbrenner, and H. Reichi, "Ultra thin chips for miniaturized products," in Proc. 52nd Electron. Compon. Technol. Conf., May 2002, pp. 1110-1113.
2. M. Feil, C. Adler, D. Hemmetwberger, M. Konig, and K. Bock, "The challenge of ultra thin chip assembly," in Proc. 54th Electron. Compon. Technol. Conf., Jun. 2004, vol. 1, pp. 35-40.
3. L. Wang, K. M. B Jansen, M. Bartek, A. Polyakov, and L. J. Ernst, "Bending and stretching studies on ultra-thin silicon substrates," in Proc. 6th Int. Conf. Electron. Packag. Technol., Aug. 30-Sep. 2, 2005, pp. 682-686.
4. G.-Q. Lu, G. B. Kromann, B. Mogilevsky, and T. K. Gupta, "Evaluation of die-attach adhesives by curvature measurements," in Proc. Intersoc. Conf. Thermal Phenom. Electron. Syst., Feb. 1992, pp. 155-158.
5. W. Ren and J. Wang, "Shell-based simplified electronic package model development and its application for reliability analysis," in Proc. 5th Conf. Electron. Packag. Technol., Dec. 2003, pp. 217-222.
6. J. J. Wortman and R. A. Evans, "Young's modulus, shear modulus, and Poisson's ratio in silicon and germanium," J. Appl. Phys., vol. 36, no. 1, pp. 153-156, Jan. 1965.
7. ANSYS User's Manual. version 11.0.
8. J. Malzbender and R. W. Steinbrech, "Mechanical properties of coated materials and multi-layered composites determined using bending methods," Surf. Coat. Technol., vol. 176, no. 2, pp. 165-172, Jan. 2004.
9. D. H. Doehlert, "Uniform shell designs," Appl. Stat., vol. 19, no. 3, pp. 231-239, 1970.
10. NEMROD User's Manual, LPRAI, Marseille, France. version 2000-D.