Advanced ceramics in wire bonding capillaries for semiconductor package technology

Materials Science and Engineering: A

Volumn 498, Issue 1-2, 2008, Pages 129-134

  Kim, Ik Jin ^a   Kim, Hee Seung ^b   Seo, Mi Young ^b   Gauckler, Ludwig J ^c  

^a Hanseo University   (South Korea)

^b Institute of Advanced Ceramics for Semiconductor in BIEMT Co Ltd   (South Korea)

^c ETH ZURICH   (Switzerland)

Author keywords

Al2O3 Cr2O3 composites (ruby); Bonding capillary; Hardness; Toughness; Young's modulus; ZTA (zirconia toughened alumina)

Indexed keywords

ALUMINA; ALUMINUM OXIDE; CERAMIC MATERIALS; CHROMIUM COMPOUNDS; CORROSION RESISTANCE; ELASTIC MODULI; HIGH TEMPERATURE APPLICATIONS; INJECTION MOLDING; LIQUID CRYSTALS; MICROSTRUCTURE; SINTERING; THERMAL EXPANSION; ZIRCONIA;

ADVANCED CERAMICS; AL2O3-CR2O3 COMPOSITE (RUBY); BONDING CAPILLARY; HOT-ISOSTATIC PRESSINGS; PACKAGE TECHNOLOGIES; SEMICONDUCTOR PACKAGES; WIREBONDING; YOUNG MODULUS; ZIRCONIA TOUGHENED ALUMINA; ZIRCONIUM TOUGHENED ALUMINA;

HARDNESS;

EID: 54849406546     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.10.130     Document Type: Article

References (19)

1. Lee Y.L., Scotti R.E., Ramsey D.A., and Bolle C.A. J. Electron. Packag. 125 (2003) 325-328
2. Saiki H., Marumo Y., Nishitake H., Uemura T., and Yotsumoto T. J. Mater. Sci. Technol. 177 (2006) 709-712
3. Nihara K. J. Ceram. Soc. Jpn. 99 (1991) 974-980
4. Munro R.G. J. Am. Ceram. Soc. 80 (1997) 1919-1928
5. Green D.J., Cai P.Z., and Messing G.L. J. Eur. Ceram. Soc. 19 (1999) 2511-2517
6. Ha C.G., Jung Y.G., Kim J.W., Jo C.Y., and Paik U. Mater. Sci. Eng. A337 (2002) 212-216
7. Doerre E., and Huebner H. Alumina-Processing, Properties and Applications (1984), Springer-Verlag, Berlin pp. 216-282
8. Kaysser W.A., and Sprissler M. J. Am. Ceram. Soc. 70 (1987) 339-343
9. Handwerker C.A., Morris P.A., and Coble R.L. J. Am. Ceram. Soc. 72 (1989) 130-136
10. Roedel J., and Glaeser A.M. J. Am. Ceram. Soc. 73 (1990) 3292-3301
11. Song H., and Coble R.L. J. Am. Ceram. Soc. 73 (1990) 2077-2085
12. Anstis G.R., Chantikul P., Lawn B.R., and Marshall D.B. J. Am. Ceram. Soc. 64 (1981) 539-543
13. Nosbusch H., and Mitchell I.V. Technical Ceramics (1988), Elsevier Applied Science pp. 35-41
14. Morrell R. Handbook of Properties of Technical and Engineering Ceramics, Part 1 (1985), HMSO, London
15. Lim H.T., and Lim D.S. J. Kor. Ceram. Soc. 32 (1995) 559-566
16. Lawn B.R., Marshall D.B., Anstis R.A., and Dabbs T.P. J. Mater. Sci. 16 (1981) 2846-2854
17. Cook R.F., Fairbanks C.J., Lawn B.R., and Mai Y.W. J. Mater. Res. 2 (1987) 345-356
18. R. Ringer, J. Castaneda, Chip Scale Package (CSP) Wire Bonding Capability Study, ST Assembly and Test Services Pte. Ltd., Singapore 768442 and SPT Asia Pte. Ltd., Singapore 7318992.
19. J.H. Lau, S.W. Ricky Lee, Chip Scale Package-Materials, Process, Reliability, and Applications, 1999.