Application of wavelet package analysis and support vector machine to fault diagnosis of cutting tool

Zhendong Ceshi Yu Zhenduan/Journal of Vibration, Measurement and Diagnosis

Volumn 28, Issue 3, 2008, Pages 273-276

  Wang, Jisheng ^a   Yu, Junxin ^a   Huang, Weigong ^a  

^a XIHUA UNIVERSITY   (China)

Author keywords

Cutting tool; Fault diagnosis; Support vector machine; Wavelet package analysis

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; CUTTING TOOLS; ELECTRIC FAULT CURRENTS; IMAGE RETRIEVAL; LEARNING SYSTEMS; MACHINE TOOLS; METAL WORKING TOOLS; VECTORS;

FAULT DIAGNOSIS; SMALL SAMPLES; STATIONARY SIGNALS; SUPPORT VECTOR MACHINE; SUPPORT VECTORS; SVM CLASSIFIERS; WAVELET PACKAGE ANALYSIS; WAVELET PACKAGES;

SUPPORT VECTOR MACHINES;

EID: 54549087706     PISSN: 10046801     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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