Wavelet package analysis to picking-up characteristics of AE signal of tools

Shuju Caiji Yu Chuli/Journal of Data Acquisition and Processing

Volumn 20, Issue 3, 2005, Pages 346-350

  Yu, Jun Xin ^a   Wang, Ji Sheng ^a   Huang, Wei Gong ^a   Li, Jiang ^a  

^a XIHUA UNIVERSITY   (China)

Author keywords

Acoustic emission; Inspection; Tools; Wavelet package analysis

Indexed keywords

EID: 27244433582     PISSN: 10049037     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)