Analysis of thermal damage in bulk silicon with femtosecond laser micro-machining

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5339, Issue , 2004, Pages 73-83

  Coyne, Ed ^a,b   O'Connor, Gerard M ^a   Mannion, Paul ^a   Magee, Jonathan ^a   Glynn, Thomas J ^a  

^a NATIONAL UNIVERSITY OF IRELAND   (Ireland)

^b ANALOG DEVICES   (Ireland)

Author keywords

EDX; Femtosecond; Laser; Materials; Micromachining; Processing; SEM; Silicon; Thermal effects

Indexed keywords

AMPLIFICATION; ENERGY DISPERSIVE SPECTROSCOPY; MICROMACHINING; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SCANNING TUNNELING MICROSCOPY; SEMICONDUCTOR MATERIALS; SILICON; STRESS ANALYSIS; THERMAL EFFECTS;

FEMTOSECOND LASERS; LASER MATERIALS; LASER PROCESSING; THERMAL DAMAGES;

LASER APPLICATIONS;

EID: 5444227710     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.529218     Document Type: Conference Paper

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