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Volumn 47, Issue 4 PART 2, 2008, Pages 2379-2382

Tinv scaling and gate leakage reduction for n-type metal oxide semiconductor field effect transistor with HfSix/HfO2 gate stack by interfacial layer formation using ozone-water-last treatment

Author keywords

Gate last process; Hf diffusion; HfO2; HfSix; HR ARS; IFL; Jg; MEM; nMOSFET; Ozone water; Tinv

Indexed keywords

CHARGE COUPLED DEVICES; ELECTRIC CONDUCTIVITY; FIELD EFFECT TRANSISTORS; GASES; HAFNIUM; HAFNIUM COMPOUNDS; LOGIC GATES; METALLIC COMPOUNDS; MOS CAPACITORS; MOS DEVICES; MOSFET DEVICES; OZONE; OZONE LAYER; SEMICONDUCTOR DOPING; SEMICONDUCTOR MATERIALS; TRANSISTORS;

EID: 54249089872     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.2379     Document Type: Article
Times cited : (3)

References (12)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.