메뉴 건너뛰기




Volumn , Issue , 2004, Pages 767-770

PEEC equivalent circuits for dispersive dielectrics

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LOSSES; DIELECTRIC MATERIALS; ELECTRIC NETWORK ANALYSIS; ELECTRONIC EQUIPMENT MANUFACTURE; NETWORKS (CIRCUITS); PERMITTIVITY; PIERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

EID: 54249083092     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (4)
  • 1
    • 0026890885 scopus 로고
    • Circuit Models for Three-Dimensional Geometries Including Dielectrics
    • July
    • A. E. Ruehli, H. Heeb, Circuit Models for Three-Dimensional Geometries Including Dielectrics, IEEE Trans. on Microwave Theory and Techniques, vol. 40(7): 1507-1516, July 1992.
    • (1992) IEEE Trans. on Microwave Theory and Techniques , vol.40 , Issue.7 , pp. 1507-1516
    • Ruehli, A.E.1    Heeb, H.2
  • 3
    • 0016481606 scopus 로고
    • Fast and Accurate Switching Transient Calculations on Transmission Lines with Ground Using Recursive Convolution
    • A. Semlyen, A. Dabuleanu, "Fast and Accurate Switching Transient Calculations on Transmission Lines with Ground Using Recursive Convolution", IEEE Trans. on Power Apparatus and Systems, PAS-94: 561-571, 1975.
    • (1975) IEEE Trans. on Power Apparatus and Systems , vol.PAS-94 , pp. 561-571
    • Semlyen, A.1    Dabuleanu, A.2
  • 4
    • 0035703753 scopus 로고    scopus 로고
    • Generalized PEEC Models for Three-Dimensional Interconnect Structures and Integrated Passives of Arbitrary Shapes
    • Boston, MA, October
    • A. Rong, A. C. Cangellaris, "Generalized PEEC Models for Three-Dimensional Interconnect Structures and Integrated Passives of Arbitrary Shapes", in Digest of Electr. Perf. Electronic Packaging, Boston, MA, October, 2001.
    • (2001) Digest of Electr. Perf. Electronic Packaging
    • Rong, A.1    Cangellaris, A.C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.